Omron applications in semiconductor wire bonding equipment

Process introduction

High-purity gold wire (Au), copper wire (Cu) or aluminum wire (Al) is used to connect the Pad and Lead by soldering.

Omron applications in semiconductor wire bonding equipment

　　■ PAD is the external contact point of the circuit on the chip

■ Lead is the connection point on the Lead Frame.

W/B is the most critical part of the packaging process.

　　problem

1. Under ultra-high acceleration, it is easy to produce large deviations

Since the wires are all small segments of less than 4 mm, a very large acceleration is required to quickly reach the target speed. However, once the acceleration is too fast, the welding is prone to deviation, and it is difficult to ensure the yield of the product.

2. The instability of the motion control of the gantry mechanism

The motion accuracy of the gantry mechanism is affected by factors such as the accuracy of motor tuning, the synchronization accuracy of gantry movement and the accuracy of gantry zero-seeking repeatability, which may cause the accuracy of the final action to be insufficient.

　　3. Affected by cogging force, there is a follow-up error

Due to the structure of the stator of the linear motor, the linear motor will be affected by the cogging torque during the movement, resulting in periodic change following error.

4. It is necessary to maintain a constant pressure to solder the chip

solution

ultra-high-speed synchronous control,

Achieve a margin of error of only μ levels

Through Omron's programmable multi-axis motion controller CK series, the controller's high-performance servo algorithm and ultra-high scanning cycle (16-32K) are used to improve the response frequency of the servo cycle and achieve nano-level high-precision control. Finally, the control target of 20g in the XY axis and 160g in the Z axis was achieved, and the error range was stable to 1μm from 3 to 4ms.

　　Unique cross-decoupling control,

Ensure the motion accuracy of the gantry mechanism

Through Omron's programmable multi-axis motion controller CK series, the unique cross-decoupling control ensures the absolute level of the gantry in operation, and the zeroing mode specially designed for the gantry can also ensure the absolute level of the gantry after zeroing.

　　Using iterative self-learning algorithm,

Complete compensation of cogging forces

In general, generating a torque compensation table solves this problem. However, the measurement of cogging force is more difficult. Therefore, we use Omron's programmable multi-axis motion controller CK series with its own iterative learning control algorithm to automatically identify the cogging force, so as to complete the compensation of the cogging force and minimize the fluctuation of the following error.

　　Cascade algorithms are used to adjust the pressure in real time

Control system

■ Programmable multi-axis motion controller CK series

　　Deliver value

XY-Stage performance metrics

❶ XYZ acceleration: 20g, 20g, 160g

❷ Settling time: 2 to 4ms

❸ Maximum tracking error: 15μm

Gantry mechanism performance indicators

❶ XYZ acceleration: 5g, 5g, 10g

❷ Settling time: 3 to 5ms

❸ Maximum following error: 10μm

❹ Gantry two-axis deviation: 4μm

　　Management layer

■ In order to respond to the diversification of consumer product needs and the shortening of product life cycles, we have introduced highly creative motion control technology into the production site, realized the geometric improvement of equipment speed and accuracy, and created the industry's top competitiveness.

Management

■ Omron's programmable multi-axis motion controller, compatible with third-party products, allows customers to have more choices, such as choosing more economical motors and drives, which can improve the price advantage of equipment.

■ The positioning of the moving mechanism and the improvement of the speed and accuracy of the inspection are completely based on the optimization of the control system and program, without changing the mechanical structure and movement time, and the introduction time is faster and the cost is lower.

Engineer layer

■ The speed and accuracy of the equipment have been significantly improved, the stability time is 3 to 4ms, the error is controlled at 1μm, and the synchronization of gantry dual drive is perfectly guaranteed, and the acceleration reaches 5g.

■ Omron programmable multi-axis motion controller CK series, built-in iterative self-learning and other algorithms, can be directly called, simple debugging, short development cycle.

Article source: Omron Industrial Automation Information Account

Omron applications in semiconductor wire bonding equipment

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