Fuji Electric Corporation (CEO, Director and President: Tsuhiro Kitazawa, Headquarters: Shinagawa-ku, Tokyo) is pleased to announce that the second-generation discrete SiC-SBD* series, a series of power semiconductors, has been released for sale. This product will help drive power savings in data centers and communication base stations, among others.
1. Background
With the launch of digital transformation (DX), the increasing popularity of remote work, and the widespread use of Internet services, the amount of network traffic is increasing, and the investment in equipment for data centers and communication base stations is accelerating. At the same time, the demand for power supply equipment is increasing, and the current market size for power supply equipment is about 300 billion yen, which is expected to grow to about 450 billion yen by FY2028*.
The operation of equipment in data centers and communication base stations requires a large amount of direct current power, so power supply equipment is generally equipped with power semiconductors (diodes) to efficiently convert (rectify) the alternating current supplied by the power company into direct current.
Power semiconductors generate power losses (constant losses) when they are energized. This time, we have developed and launched the "2nd Generation Discrete SiC-SBD Series" for power supply equipment such as data centers and communication base stations, which can help devices save power by reducing constant losses in circuits.
We will promote this product globally and contribute to the creation of a decarbonized society by promoting power saving in our facilities.
2. Product features
The thickness of the circuit board has been reduced to one-third for low loss
One of the ways to reduce the power loss of power semiconductors is to make the circuit board as a component thinner to shorten the distance over which the current can be conducted. Compared to our predecessor's first-generation SiC-SBD series, the thickness of the SiC (silicon carbide) circuit board has been reduced by about one-third of the thickness of the board and the constant loss has been reduced by 16%* by adjusting the chip structure. We use our proprietary processing technology to reduce the thickness of the circuit board to achieve the highest level of thinness in the industry. In addition, the product improves resistance to high currents caused by lightning strikes. This will contribute to the energy efficiency and reliability of the equipment on board.
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