Sick sensors – the future of photoelectric sensors

Create Date: 2024-8-30 12:03:23|Source: SICK/Sick

Photoelectric sensors are controlled by converting changes in light intensity into changes in electrical signals.

Photoelectric sensors are generally composed of three parts: light source, optical path and optoelectronic components. The measured change is converted into a change in the optical signal, which is then further converted into an electrical signal with the help of an optoelectronic element.

The four major categories of sensor use are industrial and car electronic products, communication electronic products, and consumer electronics special equipment, during which the sensor market in the field of industrial and car electronic products accounts for about 42%. In the future, with the development and spread of Internet of Things skills, the use of photoelectric sensors will penetrate into all aspects of human life.
Sick sensors – the future of photoelectric sensors
  In the future, the development direction of photoelectric sensors will be as follows:

Highly integrated

Due to the shrinking design space, cost, and power budgets, it is important to integrate multiple sensitive components on the same substrate to create a multi-functional combined MEMS sensor that can detect multiple parameters.

Low power consumption

The demand for reducing the power consumption of the sensor, using environmental energy harvesting to complete the self-supply, and enhancing the battery life will be accompanied by the development of the sensor, and it will become increasingly intense.

Miniaturization

The miniaturization of the sensor refers to the characteristic size of the sensitive element as "millimeter (mm)-micrometer (um)-nanometer (nm)" type of sensor. This kind of sensor has the advantages of miniaturization and performance in size, the integration of elements and the diversity of uses, and the complexity of system and structure in function. The miniaturization of sensors is not only a miniaturization or reduction of feature size, but a high-tech miniature system with new mechanisms, new structures, new effects and new functions. Its preparation process involves MEMS skills, 1C skills, laser skills, fine ultra-fine processing skills, etc.

Intelligent

Skills development: Digital signal processors (DSPs) will enable the development of many new next-generation sensor products. With the development of 5G communication, big data, AR, VR, cloud computing, etc., as well as the use of new skills such as robot internal driving and artificial intelligence, the world has entered the intelligent era from the original era of electricity, and sensors have also ushered in a new era of intelligence.

High sensitivity

Photoelectric sensorWhen a person or object enters the sensing range (reflection point, small angle) in front of the sensor, the sensor outputs immediately, and the sensor immediately closes the output after the person or object is detached. For example, in the intelligent lighting, the lights can be turned on and the lights are turned off, and then the quiet living space in the building can be effectively guaranteed.

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