INVT DA300 linear drive application in die bonder

LED die bonder is an automatic production equipment with high precision and high efficiency that absorbs LED wafers from LED wafer trays and mounts them onto PCBs to realize the automatic fitting of LED wafers and defective wafer detection functions. The customer of this project is a leading manufacturer of optoelectronic automation equipment, and INVT servo is applied to the customer's die bonding machine, with leading performance and high cost performance, to improve the manufacturing process and efficiency, and meet the needs of large-scale and lean production.

INVT DA300 linear drive application in die bonder

A total of 8 sets of servo drives are used on the die bonding machine to control the X-axis transmission mechanism and the crystal extraction action of the bonding arm. The servo motor drives the connecting rod to rotate quickly forward and backward through the synchronous belt, so that the bonding arm equipped with the crystal suction nozzle can be counterclockwise and displace in the clockwise direction of the LED crystal expander, and after the counterclockwise is in place, the crystal suction nozzle sucks the wafer and then fixes the wafer clockwise. The technical requirements are as follows:

When fast positioning, the motor should be stable, not jitter and resonance, otherwise the position of crystal suction and die bonding will not be accurate;

Each action cycle is as fast as possible, and the acceleration is as large as possible, so there are high requirements for the response of the servo.

The equipment is miniaturized and lightweight, saving installation space.

The parameters of the debugging interface are common and do not need to be converted.

INVT DA300 servo has fast dynamic response, accurate positioning, short setting time, self-adaptation, stable operation, fast positioning response time of 5ms, no need to slow down the operation of direct drive and direct connection mechanism, no longer need reducer, reduce the user's mechanical input cost, and significantly improve the manufacturing process and efficiency.

The DA300 has a response of up to 3.0kHz, which greatly improves the productivity of the die bonder.

The DA300 supports linear motors, no intermediate transmission, stronger torque output, faster dynamic response, greater acceleration, and maximizes high-end mechanical performance.

The positioning accuracy is high, the positioning time is short, and the closed-loop feedback control of linear position detection significantly improves the repeatable positioning accuracy and greatly improves the production efficiency of the die bonding machine.

Low-frequency vibration suppression, disturbance suppression, friction torque compensation, automatic/manual filter notch design, comprehensive vibration suppression, excellent anti-interference.

Through the simple adjustment of gain parameters, the die bonding cycle is as low as 100ms, which improves the manufacturing efficiency.

The bus constitutes a closed-loop control system, which has the characteristics of easy scalability, simplified wiring, etc., and can support Ethernet communication protocol.

The customer's automatic die bonding machine uses DA300 linear drive servo, which makes the equipment perform well in terms of speed, accuracy, stability and cost performance. The die bonding capacity of the equipment has reached 25K/H, and the production excellence rate has reached 99.9%, which greatly improves the production efficiency.

INVT DA300 linear drive application in die bonder

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