Process introduction
The gluing developer is a very important equipment for the lithography process section of chip making, which is used to realize the ultra-thin film of photoresist. It is divided into two steps: 1. Gluing process: the photoresist is dropped onto the surface of the wafer through the glue head, and the vacuum suction cup sucks the wafer and rotates at high speed for homogenization.
2. After the homogenization is completed, the film is baked, and the organic solvent in the photoresist is volatilized through the heating plate to generate an ultra-thin film of photoresist.
1. The temperature rise rate is not uniform and the temperature difference fluctuates,
Resulting in uneven wafer heating
Once there is uneven heating of the heating plate, some organic solvents in the photoresist may not be effectively volatilized, which will affect the quality of the final adhesive film.
2. Manual adjustment, the process is complex and time-consuming
solution
Through the temperature uniform control technology,
Uniform heating with high precision
Through the optimization algorithm and the automatic compensation algorithm of MATLAB to achieve uniform heating (we call it the temperature uniformity control technology), the temperature control accuracy of each zone reaches ±0.05°C, and the temperature uniformity reaches R=0.275.
Experimental data show that the temperature difference can be controlled to 1/5 of the original level
The adjustment time is only 2 seconds,
Completely replace manual dialing
With a simple setting, the entire space or surface can be distributed with the same specified amount. The work that used to require manual adjustment has been fully automated, which greatly reduces the investment in labor costs and reduces the dependence on skilled workers.
Control system
● Mechanical automation controller NJ/NX series
● NX series EtherCAT connector unit
● NX series temperature input unit
● NX series digital output unit
Deliver value
● Temperature control accuracy: ±0.05°C
● Temperature uniformity: R=0.275, where R=Tmax-Tmin.
● Adjustment time: 2 seconds
【Management】
■ In the fierce competition environment of the entire SEMI industry, the application of temperature uniformity control technology in the gluing developer has broken the technical monopoly of foreign manufacturers and helped enterprises to further enhance their position in the industry.
【Management】
■ The improvement of temperature control accuracy is completely based on the optimization of the control system and program, without changing the mechanical structure and movement time, and the introduction time is faster and the cost is lower.
■ Through the optimization algorithm, the temperature control accuracy of each zone has reached ±0.05°C, and the temperature uniformity has reached R=0.275, which has greatly improved the performance index and automation level of the equipment.
【Engineer Layer】
■ The work that used to require manual adjustment has been fully automated, so that engineers can free up their hands and engage in more creative and challenging work.
■ Omron engineers participate in the whole process of guidance, and the later project is adjusted, and you only need to modify the parameters by yourself.
Source: Omron
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Contact
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