Today's electronics industry revolves around high-speed communication and supercomputing on the Internet, and the requirements for electronic products are getting higher and higher. A large number of micro-precision electronic products are constantly testing the response speed and level of major enterprises in the market. Real-time, accurate monitoring of the soldering process window by electronics manufacturers has become a key indicator of quality control. If the process window is not properly controlled, it will not only reduce production efficiency, but also increase waste; In addition, the cost of quality assurance required for manufacturing will increase as more inspection links are established.
As an indispensable component of electronic products, what is the difference between laser soldering and resistance spot soldering in the soldering process? Next, I will introduce it to you
Resistance welding: is a manufacturing process and technology that joins other thermoplastic materials such as metals or plastics by heating. This is a soldering method in which pressure is applied through electrodes after the workpieces are bonded, and soldering is carried out using the resistive heat generated by the current passing through the contact surface and adjacent joint areas. Laser soldering: It is a high-efficiency, precise, non-contact, pollution-free and radiation-free soldering method with a high energy density laser beam as the heat source. Comparatively speaking, the laser soldering process is safer and more environmentally friendly, which is in line with the current development trend.
Device differences
1. Resistance welding equipment is divided into four types according to the soldering process: spot welding machine, projection welding machine, seam welding machine and butt welding machine. It can be divided into single-phase power frequency welding machine, secondary rectifier welding machine, three-phase low-frequency welding machine, energy storage welding machine and inverter welding machine.
2. The laser soldering machine equipment is divided into three types according to the soldering method: tin wire, precision solder paste, and precision solder ball spraying, which can realize spot welding, continuous soldering and lap soldering of the equipment; It can be divided into pure fiber laser soldering, hard optical path fiber transmission laser soldering, YAG laser soldering and semiconductor laser soldering.
Resistance spot welding process:
(1) Pre-loading to ensure good contact with the workpiece.
(2) Energize to make the weld nugget and plastic ring.
(3) Forging when the power is off, so that the nugget is cooled and crystallized under the continuous action of pressure, forming a solder joint with dense structure, no shrinkage porosity and no cracks.
Laser soldering process:
(1) Use the upper fixture to fix the welding pad, and use the CCD to visually locate the solder joint;
(2) supply tin solder to the parts to be soldered;
(3) After the feeding is completed, continue the laser irradiation to reach the melting temperature of the solder;
(4) Continue irradiation to form solder joints and realize soldering;
(5) Turn off the laser after shaping.
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