Industrial Motherboard Troubleshooting - EVOC

1. Investigation and Review

The way to check is to check whether the appearance of the industrial motherboard and the parts are abnormal.

When overhauling the industrial motherboard, the first thing to do is to investigate whether the capacitors on the industrial motherboard are bulging, leaking or severely damaged; Whether the resistor and capacitor pins are in contact with each other, whether the surface is scorched, whether the chip surface is cracked, and whether the copper foil is fused.

Check that the plugs and sockets are tilted; Check for foreign objects falling into the parts of the industrial motherboard; Check to see if the chip is abnormally hot.

Industrial Motherboard Troubleshooting - EVOC

Industrial Motherboard Troubleshooting - EVOC

2. Comparative approach

The comparative approach is a simple and easy way to protect. When patching, prepare the same type of motherboard as the faulty industrial motherboard. When questioning some modules, test the same test points on both boards and use the correct characteristics (waveform or voltage). ) to see which module's waveform or voltage mismatch is compared to the faulty motherboard, and then the POI detects the inconsistencies point by point before finding and resolving the fault.

3. Measurement methods

The measurement method includes the resistance measurement method and the voltage measurement method.

The resistance measurement method is to measure the magnitude of the resistance value, roughly judge the quality of industrial motherboard chips and electronic components, and judge the severe short circuit and open circuit of the circuit. If the diode is used to measure whether the transistor has a severe short circuit or open circuit to determine whether it is good or bad, perhaps the resistance of the ISA socket is measured to determine the quality of the south-bridge chip.

The voltage measurement rules are mainly to measure the voltage, and then compare it with the test points of ordinary industrial motherboards to find out the test points with different differences, and finally find out the faulty components and eliminate the faults according to the lines of the test points (running circuits).

Fourth, the substitution method

The substitution is to replace the suspicious component with a superior one. If the problem goes away, it means that the suspect is right. Otherwise, this is a discriminating error and should be further examined and discerned.

5. Exemption from the T temperature method

The temperature rise and fall method is mainly aimed at the situation that the industrial motherboard has a problem due to the poor thermal stability of a certain component. When the temperature of a suspicious component rises abnormally and can be detected, cooling is used to force it to cool. If the defect disappears or tends to reduce, it can be determined that the part is in a hot state. When the problem occurs when the power is applied for a long time or the problem changes with the season, the suspicious part is heated by heating to raise the temperature. If there is a problem, it can be judged that the thermal stability is poor.

Sixth, clean inspection methods

The cleaning method is suitable for situations where the working environment is complex and there is a suspicion that the industrial motherboard may have problems due to dust, etc. When cleaning, use a brush to quietly remove dust from industrial motherboards. In addition, some cards and chips on industrial motherboards are pined, which often leads to poor contact due to pin oxidation, and the surface oxide layer can be pierced from scratch by an eraser.

Industrial Motherboard Troubleshooting - EVOC

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