In the first quarter of 2022, Advantech, a leading global provider of embedded computing solutions, is pleased to announce the release of the EPC-R7200, an industrial-grade AI edge intelligent system compatible with NVIDIA Jetson. As the adoption of edge AI devices on the NVIDIA Jetson platform continues to increase, the EPC-R7200 is becoming more demanding in an ultra-compact form factor (152×137×42mm; 5.9 ×5.3 ×1.6 inches) meets the compatibility needs. The edge intelligence system uses the NVIDIA Jetson family of modules, including Jetson Xavier™NX, Jetson™TX2 NX, and Jetson Nano™. ) is specially designed by AI developers. These features make the EPC-R7200 an excellent choice for prototyping and large-scale deployment of edge AI applications in different industries.
AI accelerator with support for NVIDIA Jetson
Advantech's EPC-R7200 industrial-grade AI edge intelligence system is equipped with a functional carrier board that is fully compatible with three types of Jetson modules in terms of form factor and pin configuration. With a complete industrial-grade system design concept, the EPC-R7200's high-quality aluminum enclosure provides thermal upgrades and ESD protection for powerful equipment protection. In addition, the EPC-R7200's thermal solution is suitable for both modular and module-specific heat sinks. This enables developers to adopt thermal solutions based on the Jetson modules of their applications.
The NVIDIA Jetson module works in tandem with the NVIDIA JetPack™SDK. JetPack™ includes the Jetson Linux Driver Pack (L4T) with Ubuntu Linux operating system and CUDA-X, both solutions to help accelerate AI development. The EPC-R7200 is fully compatible with the NVIDIA SDK, enabling AI developers to transfer Jetson modules from the kit to Advantech's EPC-R7200 while automatically booting up the I/O interface without the need to install further drivers or set up feature configurations. In addition, Advantech's EPC-R7200 has an operating temperature, wide power input, and high vibration tolerance (-40-85°C/-40-185°F; 9——24VDC； 3.0Grms). Similarly, it transforms the Jetson family of modules into edge AI systems, which in turn enables users to generate on-site prototypes while significantly reducing the development time and resource requirements required for system integration and validation.
Scalable I/O design to meet diverse application needs
The EPC-R7200 provides 2×2 channels of MIPI-CSI2 camera input for intelligent vision systems, as well as 1 HDMI 2.0 port for 4K resolution displays and 2 GbE LAN for connectivity. 2 x USB 3.2 Gen ports and 2 x M.2 slots for wireless modules (1 x 2230 Key E and 1 x 3042 Key B). Based on the UIO40-Express mechanical design, the EPC-R72000's carrier board features an application-oriented I/O expansion board to increase the device capacity. Developers are therefore able to select I/O expansion boards, such as the M.22280 Key M-slot, through connectivity to NVMe SSDs, serial ports (RS-232, RS-485), isolated DI/DOS, USB 2.0, and 4-port GbE Ethernet hubs for additional storage. In addition, Advantech's AIM-Linux software service provides UIO40-Express peripheral drivers for NVIDIA JetPack SDK 4.5.1, so that UIO40-Express can run without additional integration operations.
EPC-R7200 Key Features:
A fanless ultra-compact AI edge intelligence system designed according to thermodynamic principles
Compatible with NVIDIA Jetson modules: Jetson Xavier™NX, Jetson™TX2 NX, and Jetson Nano™
Compatible with the flexible, application-oriented UIO40-Express I/O board
Rugged edge intelligence system enclosure with operating temperature range, wide power input and high vibration tolerance (-40-85°C; -40 - 185°F/9 - 24VDC/3.0Grms).
AIM-Linux software service with integrated peripheral drivers and support for NVIDIA JetPack SDK.
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